Methods and Apparatus of Packaging with Interposers

摘要

Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost.

主权项

1. A method comprising:
providing an interposer comprising:
an insulating layer at a top surface; anda contact pad extending into an opening in the insulating layer, wherein the contact pad is electrically connected to a metal layer within the interposer; forming a micro-bump layer over the interposer, wherein the micro-bump layer comprises:
a micro-bump line over the insulator layer; anda micro-bump connected to the contact pad; bonding a first die to the interposer, wherein bonding the first die comprises electrically connecting the first die to the micro-bump line and the micro-bump; and bonding a second die to the interposer adjacent the first die, wherein bonding the second die comprises electrically connecting the second die to the micro-bump line, wherein electrical signals transmitted between the first die and the second die through the micro-bump line are not transmitted through the interposer.