发明名称 THE METHOD OF THERMOPLASTIC POWDER COATING ONTO WOOD CHIP BOARD OR PAPER BOARD
摘要 <p>The present invention relates to a method for coating thermoplastic resin powder on the surface of a wood board or a paper board, which comprises the following steps: (a) preheating a wood board or a paper board or a wood board or a paper board not coated with a liquid primer at 100-300°C which is a melting temperature of a thermoplastic resin to be surface-coated; (b) powder-coating thermoplastic resin powder on the preheated surface of the wood board or the paper board in the thickness of 200-1,500 um; and (c) performing post-thermal treatment on the powder-coated wood board or paper board, thereby coating functional plastic resin powder having water resistance, corrosion resistance, abrasion resistance, or electrical conductivity on the surface of a wood board or a paper board which is a non-conductive material having absorbability, and impossible of electrostatic powder coating by a powder coating method.</p>
申请公布号 KR101549873(B1) 申请公布日期 2015.09.03
申请号 KR20140063044 申请日期 2014.05.26
申请人 COCOSOL CO., LTD. 发明人 MOUN, YOUNG JOON;JEONG, SUNG DOO
分类号 B05D1/06;B05D3/02;B05D7/06 主分类号 B05D1/06
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