发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which efficiently uses a process liquid while heating the process liquid in a more efficient manner to process a surface of a plate-like substrate.SOLUTION: A substrate processing apparatus includes a process liquid supply mechanism 50, which supplies a process liquid S to a surface of a plate-like substrate 100 held by a rotary substrate holding part 10, and processes the surface of the plate-like substrate 100 with the process liquid S. The substrate processing apparatus includes: a process liquid retaining plate 15 which is disposed so as to face the surface of the plate-like substrate 100 held by the substrate holding part 10 and form a predetermined space between itself and the surface of the plate-like substrate 100; and a heating part 20 which contacts with a predetermined area of the process liquid retaining plate 15 which includes a position corresponding to a rotation axis of the substrate holding part 10 and heats the predetermined area. The process liquid supply mechanism is formed so as to supply the process liquid S to a space between the surface of the plate-like substrate 100 that rotates with the substrate holding part 10 and the process liquid retaining plate 15 heated by the heating part 20. |
申请公布号 |
JP2015159331(A) |
申请公布日期 |
2015.09.03 |
申请号 |
JP20150096769 |
申请日期 |
2015.05.11 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
KUROKAWA SADAAKI;HAMADA KOICHI;KOBAYASHI NOBUO;NAGASHIMA YUJI |
分类号 |
H01L21/027;G03F7/42;H01L21/304 |
主分类号 |
H01L21/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|