发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which efficiently uses a process liquid while heating the process liquid in a more efficient manner to process a surface of a plate-like substrate.SOLUTION: A substrate processing apparatus includes a process liquid supply mechanism 50, which supplies a process liquid S to a surface of a plate-like substrate 100 held by a rotary substrate holding part 10, and processes the surface of the plate-like substrate 100 with the process liquid S. The substrate processing apparatus includes: a process liquid retaining plate 15 which is disposed so as to face the surface of the plate-like substrate 100 held by the substrate holding part 10 and form a predetermined space between itself and the surface of the plate-like substrate 100; and a heating part 20 which contacts with a predetermined area of the process liquid retaining plate 15 which includes a position corresponding to a rotation axis of the substrate holding part 10 and heats the predetermined area. The process liquid supply mechanism is formed so as to supply the process liquid S to a space between the surface of the plate-like substrate 100 that rotates with the substrate holding part 10 and the process liquid retaining plate 15 heated by the heating part 20.
申请公布号 JP2015159331(A) 申请公布日期 2015.09.03
申请号 JP20150096769 申请日期 2015.05.11
申请人 SHIBAURA MECHATRONICS CORP 发明人 KUROKAWA SADAAKI;HAMADA KOICHI;KOBAYASHI NOBUO;NAGASHIMA YUJI
分类号 H01L21/027;G03F7/42;H01L21/304 主分类号 H01L21/027
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