发明名称 |
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS |
摘要 |
Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser (L2), a processed article (100) having a protection layer (104) laminated to a metal layer (102) is used to process the processed article (100), whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer (104) with the short-pulse laser (L2) to ablate the protection layer (104), and a metal layer processing step for ablating the metal layer (102) in the area that was ablated during the short-pulse laser processing step. |
申请公布号 |
WO2015129362(A1) |
申请公布日期 |
2015.09.03 |
申请号 |
WO2015JP52072 |
申请日期 |
2015.01.26 |
申请人 |
MITSUBISHI HEAVY INDUSTRIES, LTD. |
发明人 |
GOYA, SANEYUKI;KINOUCHI, MASATO;TAKITA, ATSUSHI;DANNO, MINORU;WATANABE, TOSHIYA;ISHIDE, TAKASHI |
分类号 |
B23K26/388;B23K26/064 |
主分类号 |
B23K26/388 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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