发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
摘要 Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser (L2), a processed article (100) having a protection layer (104) laminated to a metal layer (102) is used to process the processed article (100), whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer (104) with the short-pulse laser (L2) to ablate the protection layer (104), and a metal layer processing step for ablating the metal layer (102) in the area that was ablated during the short-pulse laser processing step.
申请公布号 WO2015129362(A1) 申请公布日期 2015.09.03
申请号 WO2015JP52072 申请日期 2015.01.26
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 GOYA, SANEYUKI;KINOUCHI, MASATO;TAKITA, ATSUSHI;DANNO, MINORU;WATANABE, TOSHIYA;ISHIDE, TAKASHI
分类号 B23K26/388;B23K26/064 主分类号 B23K26/388
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