发明名称 |
Structures with surface-embedded additives and related manufacturing methods |
摘要 |
<p>Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.</p> |
申请公布号 |
AU2011220397(B2) |
申请公布日期 |
2015.09.03 |
申请号 |
AU20110220397 |
申请日期 |
2011.02.25 |
申请人 |
INNOVA DYNAMICS, INC . |
发明人 |
MITTAL, ALEXANDER CHOW;SRINIVAS, ARJUN DANIEL;ROBINSON, MATTHEW R.;YOUNG, MICHAEL EUGENE |
分类号 |
H01B5/14 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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