发明名称 Structures with surface-embedded additives and related manufacturing methods
摘要 <p>Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.</p>
申请公布号 AU2011220397(B2) 申请公布日期 2015.09.03
申请号 AU20110220397 申请日期 2011.02.25
申请人 INNOVA DYNAMICS, INC . 发明人 MITTAL, ALEXANDER CHOW;SRINIVAS, ARJUN DANIEL;ROBINSON, MATTHEW R.;YOUNG, MICHAEL EUGENE
分类号 H01B5/14 主分类号 H01B5/14
代理机构 代理人
主权项
地址