发明名称 WIRING SUBSTRATE
摘要 <p>[Problem] To provide a printed circuit board in which it is possible to decrease generation of heat in a terminal block mounted on the printed circuit board. [Solution] A printed circuit board (10) comprising: a printed wiring (11); a terminal block (13) configured by folding a solderable plate member having a foot (31); a soldered part (14) for connecting the printed wiring (11) and the terminal block (13) arranged on the printed wiring; and a through-hole (12) provided to the soldered part (14), for insertion of the foot (31); the foot (31) being inserted into the through-hole (12) and connected by soldering; the printed circuit board comprising a solderable metal wire (17) arranged on the soldered part (14) along the terminal block (13); the soldered part (14), the terminal block (13), and the metal wire (17) being integrally soldered during soldering by solder fed through the through-hole (12).</p>
申请公布号 EP2688374(A4) 申请公布日期 2015.09.02
申请号 EP20120866400 申请日期 2012.05.30
申请人 SANYO ELECTRIC CO., LTD. 发明人 SAITO, TAKAO;OHSHIMA, MAKOTO
分类号 H05K1/18;H01R4/02;H01R4/38;H01R12/51;H01R12/58;H05K1/11;H05K3/34 主分类号 H05K1/18
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