| 摘要 |
<p>A wafer handler comprising:
a wafer loading station (3) for loading a diced wafer (1) mounted on a tacky film (2);
a tensioner (4) for tensioning the tacky film;
a picking module for successively picking a plurality of devices from said wafer;
a vision system with one or several cameras for capturing a first image of said wafer or of portions of said wafer, said image comprising a plurality of devices.</p> |
