| 发明名称 |
ADHESIVE COMPOSITION FOR TEMPORARILY BONDING USE IN WAFER MANUFACTURING |
| 摘要 |
The present invention discovers a temporarily bonded adhesive composition used in wafer manufacturing, the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, a amine and water soluble polymer. |
| 申请公布号 |
EP2798028(A4) |
申请公布日期 |
2015.09.02 |
| 申请号 |
EP20120862543 |
申请日期 |
2012.12.28 |
| 申请人 |
HENKEL (CHINA) CO. LTD.;HENKEL CORPORATION |
发明人 |
LI, LEO;ATTARWALA, SHABBIR |
| 分类号 |
C09J163/00;C08G59/68;C09J131/04;C09J139/06 |
主分类号 |
C09J163/00 |
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