发明名称 基板事前検査方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a preliminary substrate inspection method capable of preliminarily finding a substrate which may break during processing before performing processing including a step of applying a prescribed stress to the substrate. <P>SOLUTION: A preliminary substrate inspection method includes a stress application step of applying a stress to a substrate and a detection step of detecting an elastic wave which occurs in the substrate in an acoustic emission phenomenon caused by the stress applied by the stress application step. This method determines whether the substrate sustains the prescribed stress on the basis of the elastic wave detected by the detection step. If the processing is performed by a processing chamber 1 having a stage 3 which adsorbs and heats a substrate S and a step of applying the prescribed stress is a heating step of heating the substrate to a prescribed treatment temperature with the substrate S being adsorbed to the stage 3, a sensor 4 which detects the elastic wave is provided and the stress application step and the detection step are performed before completion of the heating step with the substrate S being placed on the stage 3. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5773734(B2) 申请公布日期 2015.09.02
申请号 JP20110104223 申请日期 2011.05.09
申请人 发明人
分类号 H01L21/66;G01N29/14 主分类号 H01L21/66
代理机构 代理人
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