PHOTOSENSITIVE RESIN COMPOSITION, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION

摘要

A resin composition containing the following components: (a) a polyimide precursor having a structural unit that can be represented by general formula (1) (in which A represents one of the tetravalent organic groups represented by formulas (2a) to (2d) and B represents a divalent organic group that can be represented by general formula (3)); (b) an oxime-ester compound; and (c) a solvent.