AN ACCELERATION SYSTEM IN 3D DIE-STACKED DRAM

摘要

A memory device can include: a logic layer which realizes at least one among a peripheral, an interface, and a BIST module and includes a reconfigurable accelerator (RA), wherein the reconfigurable accelerator is located in a vacant space of the logic layer and processes a part of work which the memory device processes; and at least one data layer storing data.