| 摘要 |
<p>The present invention relates to a laser polishing system, and a main object thereof is to minimize the occurrence of additional costs by minimizing the formation of fine cracks and dust during the polishing process of a glass substrate to simply configure the polishing process, thereby improving productivity, minimizing the partial temperature difference of flat glass to suppress the occurrence of fine cracks and air bubbles, forming a cross section of a projected beam to be flat to minimize stress concentration, and eliminating cracks at a portion to which a laser beam is projected. The laser polishing system comprises: a laser processing unit which irradiates a laser beam to polish a glass substrate; and a heating means for maintaining the temperature of the glass substrate before laser pretreatment. Accordingly, there is an advantage to minimize the occurrence of additional costs by minimizing fine cracks and dust during the polishing process of a glass substrate to simply configure the polishing process, thereby improving productivity, minimizing partial temperature difference of flat glass to suppress occurrence of fine crack and air bubble, forming a cross section of a projected beam to be flat to minimize stress concentration, and eliminating cracks at a portion to which a laser beam is projected.</p> |
