发明名称 接合装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cold joining device with improved reliability having a detection sensor capable of detecting an attraction state of a substrate to an electrostatic chuck without being influenced by impurities caused by activation. <P>SOLUTION: The cold joining device 1 includes a substrate holding part 44 for attracting and holding an upper substrate SA, an ion gun 32 for cleaning the upper substrate SA attracted by the substrate holding part 44, the detection sensor 50 disposed on the substrate holding part 44, and a control part 4 for controlling the ion gun 32 by the detection result of the detection sensor 50. The detection sensor 50 includes a movable part 53 displaced in contact with the upper substrate SA attracted by the substrate holding part 44, and a detection part 54 for detecting the movable part 53. When the upper substrate SA is attracted by the substrate holding part 44, the detection sensor 50 is shielded from the outside by the upper substrate SA, and therefore, the detection sensor 50 is not influenced by the impurities caused by irradiation of the ion gun 32. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5773635(B2) 申请公布日期 2015.09.02
申请号 JP20100280409 申请日期 2010.12.16
申请人 发明人
分类号 B23K20/00;B23K20/24;H01L21/02 主分类号 B23K20/00
代理机构 代理人
主权项
地址
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