| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component built-in circuit board being flat and having a high rigidity. <P>SOLUTION: A circuit board 120 has a core member 20 having: a first copper foil 22d tightly adhered to a lower surface of a resin sheet 22b and having an opening 22d-1 immediately under a mounting region 60 where a semiconductor device is mounted; a via hole 28 formed in the opening 22d-1 and penetrating through the resin sheet 22b; an electronic component 24 connected with a lower end of the via 28 and arranged on the lower surface of the resin sheet 22b; a mold resin compact 25 tightly adhered to the lower surface of the resin sheet 22b and incorporating the electronic component 24; a core plate 21 provided with a through-hole 21a through which the mold resin compact 25 is inserted, and having a rigidity; and an adhesive material 26 adhering the core plate 21 into whose through-hole 21a the mold resin compact 25 is inserted to the lower surface of the resin seat 22b. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
