发明名称 |
APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES |
摘要 |
<p>An apparatus for processing wafer-shaped articles comprises a spin chuck configured to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.</p> |
申请公布号 |
KR20150100538(A) |
申请公布日期 |
2015.09.02 |
申请号 |
KR20150025360 |
申请日期 |
2015.02.23 |
申请人 |
LAM RESEARCH AG |
发明人 |
SCHWARZENBACHER REINHOLD;PLISKA MILAN |
分类号 |
H01L21/02;H01L21/67;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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