| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin package which does not cause many burrs and is excellent in heat resistance, and to provide a light emitting device using the resin package. <P>SOLUTION: A resin package manufacturing method of this invention comprises: a first step in which a metal plate having a through hole is sandwiched with a first metal mold and a second metal mold; and a second step in which a thermosetting resin is injected into the through hole and cured. In the first step, an elastic sheet is disposed between the metal plate and the second metal mold so as to close an opening of the through hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
