| 发明名称 |
SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER |
| 摘要 |
Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (MEMS), or optoelectronic devices, from a thicker donor wafer using laser irradiation. |
| 申请公布号 |
EP2817819(A4) |
申请公布日期 |
2015.09.02 |
| 申请号 |
EP20130752284 |
申请日期 |
2013.02.26 |
| 申请人 |
SOLEXEL, INC. |
发明人 |
YONEHARA, TAKAO;RANA, VIRENDRA, V.;SEUTTER, SEAN;MOSLEHI, MEHRDAD, M.;TAMILMANI, SUBRAMANIAN |
| 分类号 |
H01L31/18;B23K26/00;H01L21/268 |
主分类号 |
H01L31/18 |
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