发明名称 Speaker module
摘要 A speaker module includes a speaker unit, a main body and a speaker carrier. The main body includes a sound outlet opening and an air pressure regulating structure. The sound outlet opening is configured to expose the speaker unit. The speaker carrier is configured to carry the speaker unit. The speaker carrier is disposed in the main body together with the speaker unit, and forms a resonance space with the main body. The air pressure regulating structure is configured to regulate the air pressure of the resonance space.
申请公布号 EP2914017(A1) 申请公布日期 2015.09.02
申请号 EP20150156036 申请日期 2015.02.20
申请人 HTC CORPORATION 发明人 LEE, YU-SHENG;CHEN, LEI
分类号 H04R1/28 主分类号 H04R1/28
代理机构 代理人
主权项
地址