发明名称 接合方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a bonding method and members to be bonded enabling stable bonding strength to be obtained even when cut surfaces for forming hollow passages and extending along the axes of the hollow passages are set as bonding surfaces which are not on the same plane. <P>SOLUTION: This bonding method is for bonding a pair of bonding members 10, 20 that comprise a conductive material and have the bonding surfaces which are not on the same plane. The bonding method includes a bonding step in which the bonding surfaces 10a, 20a of the bonding members bonded to each other are made to face each other, an electric current is made to flow from one of the bonding members to the another to perform resistance heating while the pair of bonding members are slid relative to each other, and the bonding surfaces are bonded to each other. Further, the cut surfaces 120 for forming the hollow passages 110, 111 and extending along the axes of the hollow passages are set as the bonding surfaces which are not on the same plane. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5771974(B2) 申请公布日期 2015.09.02
申请号 JP20100279806 申请日期 2010.12.15
申请人 发明人
分类号 B23K20/00;B23K11/11;B23K11/12;B23K20/10;B23K20/12;B23K20/24 主分类号 B23K20/00
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