| 摘要 |
A light emitting device comprising: at least one light emitting diode (LED) in a chip on board configuration mounted on a printed circuit board (PCB); a cylindrical ring surrounding the LED having a first end and an opposing second end and attached at the first end to the PCB; an encapsulant within the cylindrical ring; a plurality of quantum dot nanoparticles within the cylindrical ring in optical communication with the LED; and a transparent cap attached to the second end of the cylindrical ring. The quantum dots modify the spectral output of the at least one LED exhibit and exhibit less of a performance decrease (due to increased temperature) when incorporated in a chip on board (COB) as compared to conventional LED packages. The cylindrical ring may be a ceramic ring, the ring acts to shield the quantum dots from the heat associated with connecting electrical leads to pads on the COB. The transparent cap may be a glass disk and may be sealed to the cylindrical ring. |
