发明名称 発光素子
摘要 The invention provides a light-emitting element, which comprises an LED and a protection diode, forming on the same substrate, and is suitable for the installation of a flip chip. An LED is formed in an LED area (X) and the protection diode is formed in a protection diode area (Y). At this time, an LED anode (51a) and a protection diode cathode (52b), an LED cathode (52a) and a protection diode anode (51b) respectively clamp a separation groove (Z). Under the circumstance that the thickness of a P-side electrode (51) is equal to that of a n-side electrode (52), the LED anode (51a) and the LED cathode (52a) of the LED area (X) and the protection diode anode (51b) and the protection diode cathode (52b) of the protection diode area (Y) are equal in height.
申请公布号 JP5772213(B2) 申请公布日期 2015.09.02
申请号 JP20110113067 申请日期 2011.05.20
申请人 サンケン電気株式会社 发明人 杉森 暢尚
分类号 H01L33/02;H01L33/36 主分类号 H01L33/02
代理机构 代理人
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