发明名称 パワーモジュール用基板の製造方法及びパワーモジュール用基板
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a substrate for a power module, that can efficiently produce a substrate for a power module with high strength of an interface between a ceramic substrate and an aluminum layer composed of aluminum or an aluminum alloy and with excellent reliability, and provide the substrate for the power module. <P>SOLUTION: The manufacturing method for a substrate for a power module includes: a fixture step of fixing Ag to a region where at least an aluminum layer 12 is formed on one surface of a ceramic substrate 11 and forming a fixture layer 24 including Ag; a molten aluminum filling step of disposing the ceramic substrate 11 on which the fixture layer 24 is formed in a mold 50, filling the mold 50 with molten aluminum M, and bringing the ceramic substrate 11 and the molten aluminum M into contact with each other; and a solidification step of solidifying the molten aluminum M in a state of being in contact with the ceramic substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5772021(B2) 申请公布日期 2015.09.02
申请号 JP20110021895 申请日期 2011.02.03
申请人 发明人
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
代理机构 代理人
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