发明名称 METHOD FOR LASER SOLDERING CAMERA MODULE FOR MOBILE DEVICE
摘要 <p>The present invention relates to a laser soldering method of a camera module for a mobile terminal for laser-soldering a camera module having a plurality of first terminals electrically connected to components disposed inside and a printed circuit board which controls the components disposed inside the camera module and has a plurality of second terminals corresponding to the first terminals respectively together and the method includes an assembling step, a supplying step, a heating step, and a radiating step. The method includes: the assembling step of assembling the camera module and the printed circuit board with the first terminal disposed apart from the second terminal at a certain distance; the supplying step of supplying a solder to either the first terminal or the second terminal in the assembly wherein the camera module and the printed circuit board are assembled; the heating step of heating the assembly to the temperature less than or equal to a melting point of the solder; and the radiating step of radiating a laser beam to the solder so as to have the first terminal and the second terminal electrically connected by means of the solder.</p>
申请公布号 KR20150100269(A) 申请公布日期 2015.09.02
申请号 KR20140021858 申请日期 2014.02.25
申请人 DST SYSTEM CO., LTD. 发明人 CHO, TAE IK;KANG, SEOK HEE
分类号 H04N5/225;G03B17/02;H01L27/146 主分类号 H04N5/225
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