发明名称 |
METHOD FOR LASER SOLDERING CAMERA MODULE FOR MOBILE DEVICE |
摘要 |
<p>The present invention relates to a laser soldering method of a camera module for a mobile terminal for laser-soldering a camera module having a plurality of first terminals electrically connected to components disposed inside and a printed circuit board which controls the components disposed inside the camera module and has a plurality of second terminals corresponding to the first terminals respectively together and the method includes an assembling step, a supplying step, a heating step, and a radiating step. The method includes: the assembling step of assembling the camera module and the printed circuit board with the first terminal disposed apart from the second terminal at a certain distance; the supplying step of supplying a solder to either the first terminal or the second terminal in the assembly wherein the camera module and the printed circuit board are assembled; the heating step of heating the assembly to the temperature less than or equal to a melting point of the solder; and the radiating step of radiating a laser beam to the solder so as to have the first terminal and the second terminal electrically connected by means of the solder.</p> |
申请公布号 |
KR20150100269(A) |
申请公布日期 |
2015.09.02 |
申请号 |
KR20140021858 |
申请日期 |
2014.02.25 |
申请人 |
DST SYSTEM CO., LTD. |
发明人 |
CHO, TAE IK;KANG, SEOK HEE |
分类号 |
H04N5/225;G03B17/02;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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