| 摘要 |
Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder holding an optical fiber. The circuit board includes a substrate having a first surface and an opposing second surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface, and the photoelectric element aligns with the through hole. The coupler is positioned on the first surface and aligns with the photoelectric element through the through hole. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element. |
| 主权项 |
1. An optical connector, comprising:
a circuit board, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface, the substrate defining a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface; anda circuit portion formed on the substrate; a photoelectric element, the photoelectric element being positioned on the bottom surface of the receiving groove and being aligned with the through hole; a driver chip for driving the photoelectric element, the driver chip being positioned on the bottom surface of the receiving groove, the driver chip and the photoelectric element being electrically connected to each other by the circuit portion; a coupler positioned on the first surface of the substrate, the coupler being aligned with the photoelectric element through the through hole; and a holder for holding an optical fiber, the holder being supported on the first surface of the substrate and being connected to the coupler, and the coupler optically coupling the optical fiber with the photoelectric element, wherein the circuit portion comprises a plurality of contacting pads, a plurality of soldering pads, and a connecting circuit connecting the contacting pads to the soldering pads, the contacting pads are formed on the first surface, the soldering pads are formed on the bottom surface of the receiving groove, the connecting circuit comprises a first circuit and a second circuit, an L-shaped portion of the first circuit is entirely embedded in the substrate and is electrically connected to the contacting pads, a striped portion of the first circuit extends from the L-shaped portion of the first circuit and is exposed at the receiving groove, the striped portion of the first circuit is electrically connected to the driver chip, and the second circuit is exposed at the receiving groove and electrically connects the photoelectric element to the driver chip. |
