Semiconductor device with a light emitting semiconductor die

摘要

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

主权项

1. A semiconductor device comprising:
a substantially planar substrate having first and second major surfaces, the first and second major surfaces being opposed surfaces and the substantially planar substrate having first and second side surfaces between the first and second major surfaces, the first side surface having first and second sidewall surfaces between the first and second major surfaces; a partial cylindrical depression extending through the substantially planar substrate between the first and second sidewall surfaces; an electrically conductive mounting pad located on the first major surface; an electrically conductive bonding pad located on the first major surface adjacent to the electrically conductive mounting pad; a light-emitting semiconductor die having a top surface and a metalized bottom major surface that is at least partially mounted on the electrically conductive mounting pad, wherein the metalized bottom major surface comprising one of an anode and a cathode of the light-emitting semiconductor die is electrically connected to the electrically conductive mounting pad, and wherein the top surface comprising the other one of the anode and the cathode of the light-emitting semiconductor die is electrically connected to the electrically conductive bonding pad; first and second electrically conductive connecting pads located on the second major surface; a first electrically conductive edge interconnecting element located within the partial cylindrical depression and configured to electrically connect the electrically conductive mounting pad and the first electrically conductive connecting pad; and an encapsulant, through which light from the light-emitting diode will be transmitted away from the substantially planar substrate, encapsulates the light-emitting semiconductor die, the electrically conductive mounting pad, the electrically conductive bonding pad and at least a portion of the first major surface; wherein the electrically conductive edge interconnecting element defines a first curvature at the second major surface; and wherein the first electrically conductive connecting pad is spaced apart from the first and second sidewall surfaces and directly connected to only a portion of the first curvature of the first electrically conductive edge interconnecting element.