| 发明名称 | Semiconductor chip package | ||
| 摘要 | The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements. | ||
| 申请公布号 | US9123708(B2) | 申请公布日期 | 2015.09.01 |
| 申请号 | US201313782440 | 申请日期 | 2013.03.01 |
| 申请人 | Infineon Technologies Austria AG | 发明人 | Hosseini Khalil;Wowra Thomas;Mahler Joachim;Wombacher Ralf |
| 分类号 | H01L23/495;H01L23/48;H01L23/00;H01L23/29 | 主分类号 | H01L23/495 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A semiconductor chip package, comprising: a carrier; a semiconductor chip comprising a first main face and a second main face opposite to the first main face, wherein chip contact elements are disposed on one or more of the first or second main faces of the semiconductor chip, and wherein the chip is disposed on the carrier; an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face opposite to the first main face and remote from the carrier, wherein the encapsulation layer does not cover at least one side face of the carrier; first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements; and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements, wherein all of the second contact elements are disposed and extend entirely in the same plane as the carrier and at least one of the second contact elements is formed continuous with the carrier; and wherein the first and second contact elements are arranged on opposite main faces of the semiconductor chip package. | ||
| 地址 | Villach AT | ||