Thermal management for solid-state drive

摘要

An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal conduction plane. A frame is connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component. The electronic device further includes at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.

主权项

1. An electronic device comprising:
a printed circuit board (PCB) including a thermal conduction plane; at least one heat generating component mounted on the PCB and connected to the thermal conduction plane through at least one via, wherein the at least one via is located between the at least one heat generating component and the thermal conduction plane and formed directly above or directly beneath the at least one heat generating component; a frame connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component from the at least one heat generating component through the at least one via and the thermal conduction plane; and at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.