| 摘要 |
提供用于镀金或金合金之表面处理溶液和处理方法，其有效抑制从形成于该金或金合金镀膜上之针孔腐蚀下方金属或基板金属。;[解决方式]使包含二硫化物之表面处理溶液接触金或金合金之镀膜。下式(2)所表示之化合物系较佳作为该二硫化物。;X 1 O3S-R 3 -S-S-R 4 -SO3X 2 (2)于该式中，R 3 和R 4 独立表示具有1至10个碳原子之直链或分支链之伸烷基基团、具有3至10个碳原子之环状伸烷基基团、或伸苯基基团，R 3 和R 4 可独立经一个或多个选自烷基基团、卤素原子、羟基基团、或烷氧基基团之取代基取代，以及X 1 和X 2 表示单价阳离子。;[Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. ;X 1 O3S-R 3 -S-S-R 4 -SO3X 2 (2) in the formula, R 3 and R 4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R 3 and R 4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X 1 and X 2 represent monovalent cations. |
