发明名称 Electronic housing and sensor connection arrangement
摘要 A garment includes a fabric portion, an electrode fixedly connected to the fabric portion, a receptacle fixedly connected to the fabric portion, and an electronics module releasably positioned in the receptacle. The receptacle includes a receptacle housing, an electrode lead, and a receptacle contact. The electrode lead is attached to the electrode. The electrode lead engages the receptacle contact to establish an electrical connection with the receptacle contact without being attached to the receptacle contact. The electronics module includes a module contact that engages the receptacle contact when the electronics module is positioned in the socket to establish an electrical connection between the module contact and the receptacle contact.
申请公布号 US9119594(B2) 申请公布日期 2015.09.01
申请号 US201213629207 申请日期 2012.09.27
申请人 Under Armour, Inc. 发明人 Oleson Mark A.;Hollenbach Samuel J.;Kovach F. Grant;Berns Jason
分类号 A61B5/00;A41B1/08;A41B9/06 主分类号 A61B5/00
代理机构 Maginot, Moore & Beck LLP 代理人 Maginot, Moore & Beck LLP
主权项 1. A garment comprising: a fabric portion; an electrode fixedly connected to the fabric portion; a receptacle fixedly connected to the fabric portion, the receptacle comprising: a receptacle housing including a front side and a rear side with a socket defined on the front side of the receptacle housing; andan electrode lead provided within the receptacle housing, the electrode lead including a rear plate, an electrode connector extending from the rear plate, and a finger extending from the rear plate separate from the electrode connector, the electrode connector engaging the electrode and the finger extending through a channel in the receptacle housing; and an electronics module releasably positioned in the socket, the electronics module including a module housing with a module contact retained by the module housing, the electronics module further comprising a processor, a power device, and a transmitter positioned within the module housing, wherein the module contact is electrically connected to the electrode lead when the electronics module is positioned in the socket.
地址 Baltimore MD US