Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material

摘要

A package-on-package (PoP) structure comprises a first package and a second package. The first package comprises a first die, a second die, and a core material. The core material has a first surface and a second surface. A first redistribution layer (RDL) is on the first surface, and a second RDL is on the second surface. The first die is disposed in the core material between the first surface and the second surface. The second die is coupled to one of the first RDL and the second RDL. The second package comprises a third die and an interposer. The interposer has a first side and a second side. The third die is coupled to the second side of the interposer. The first package is coupled to the second package by first electrical connectors coupled to the second side of the interposer and the first RDL.

主权项

1. A package-on-package (PoP) structure comprising:
an interposer having a semiconductor substrate with a first side and a second side opposite the first side, through substrate vias through the semiconductor substrate electrically coupling a first metallization pattern on the first side of the semiconductor substrate to a second metallization pattern on a second side of the semiconductor substrate; a first die on the second side of the interposer and coupled to the second metallization pattern with first electrical connectors comprising reflowable material; a first substrate on and coupled to the second side of the interposer by second electrical connectors, the first substrate comprising:
a first core material consisting of a single material molding compound and having a first surface and a second surface;a first redistribution layer (RDL) on the first surface of the first core material, the first RDL being coupled to the second electrical connectors;a second die disposed in the first core material between the first surface of the first core material and the second surface of the first core material, conductive pillars directly coupled to the second die and having surfaces that are co-planar with at least one of the first surface of the first core material and the second surface of the first core material, the molding compound adjoining a surface of the second die perpendicular to at least one of the first surface of the core material and the second surface of the core material; anda second RDL on the second surface of the first core material; a third die coupled to the second RDL of the first substrate with third electrical connectors comprising reflowable material; and a fourth die coupled to the first RDL of the first substrate with fourth electrical connectors comprising reflowable material.