Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium

摘要

A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

主权项

1. A cleaning method that cleans a substrate on which a photoresist film is formed, the photoresist film being to be exposed to exposure light in a manner of immersion exposure with a liquid layer being formed on a top surface of the photoresist film, the cleaning method comprising:
a second-area cleaning step, wherein the substrate is held at a first area in a back surface of the substrate with a first substrate holding portion so that the top surface is kept face up, and a second area in the back surface of the substrate, the second area being not overlapped with the first area, is cleaned prior to immersion exposure; a substrate holding step, wherein the substrate is received by a second substrate holding portion, and the substrate is held at the second area in the back surface of the substrate by the second substrate holding portion; a top-surface cleaning step, wherein a top surface cleaning fluid is supplied to a top surface of the substrate that is held and rotated around a center of the substrate by the second substrate holding portion, thereby cleaning at least a part of the top surface, said part being cleaned including the center of the top surface; a bevel cleaning step, wherein a bevel cleaning fluid is supplied to a bevel portion of the substrate that is held and rotated around the center of the substrate by the second substrate holding portion, thereby cleaning the bevel portion; a back surface cleaning step, wherein one part of the back surface of the substrate, the one part not including the second area, is cleaned, the substrate being held and rotated around the center of the substrate by the second substrate holding portion, thereby cleaning the one part; and a step of, during the second-area cleaning step, creating a state of covering a substrate holding area of the second substrate holding portion with a cover member so as to prevent the cleaning fluid from being put on the substrate holding area.