| 摘要 |
一种基板结构与半导体封装件，该基板结构系包括：基板本体，系具有相对之第一与第二表面；分别形成于该基板本体之第一表面上之相邻的第一与第二线路，且该第一与第二线路均具有供电性连接外部元件之顶面；以及隔绝结构，系形成于该基板本体之第一表面上，并位于该第一与第二线路之间，以藉该隔绝结构电性隔绝该第一与第二线路。藉此，本发明能避免相邻之两线路互相电性连接而产生短路之情形。; adjacent a first and a second lines, respectively formed on the first surface of the substrate body, and the first and the second lines both have a top face for electrically connecting an exterior component; and an isolation structure, formed on the first surface of the substrate body, and located between the first and the second lines, the isolation structure is used to electrically isolate the first and the second lines. So that this invention can avoid the adjacent two lines electrically connected with each other to generate short circuit. |
