| 发明名称 | Semiconductor device and method of manufacturing thereof | ||
| 摘要 | A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film. | ||
| 申请公布号 | US9125308(B2) | 申请公布日期 | 2015.09.01 |
| 申请号 | US201313828142 | 申请日期 | 2013.03.14 |
| 申请人 | Mitsubishi Electric Corporation | 发明人 | Obara Taichi;Yoneyama Rei;Okabe Hiroyuki |
| 分类号 | H05K1/00;H05K1/02;H05K3/36 | 主分类号 | H05K1/00 |
| 代理机构 | Studebaker & Brackett PC | 代理人 | Studebaker & Brackett PC |
| 主权项 | 1. A semiconductor device comprising: a first printed circuit board; a flat cable having electrical wires and a coating film concentrically covering said electrical wires to form a series of intersecting arched surfaces, except for both ends, one end of each of said electrical wires is connected to said first printed circuit board; and a second printed circuit board connected to other end of each of said electrical wires, wherein said flat cable is bent in such a manner that said first printed circuit board and said second printed circuit board face each other, and wherein a portion of said intersecting arched surfaces is formed into a flat surface recessed into said coating film and extending transversely to said electrical wires. | ||
| 地址 | Tokyo JP | ||