| 发明名称 | Module comprising a semiconductor chip | ||
| 摘要 | A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element. | ||
| 申请公布号 | US9123526(B2) | 申请公布日期 | 2015.09.01 |
| 申请号 | US201314144192 | 申请日期 | 2013.12.30 |
| 申请人 | Infineon Technologies AG | 发明人 | Otremba Ralf;Schloegel Xaver;Low Khai Huat Jeffrey;Law Chee Soon |
| 分类号 | H01L23/48;H01L23/52;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A semiconductor device comprising: a semiconductor chip having a first terminal contact surface and a second terminal contact surface; a leadframe on which the semiconductor chip is mounted, wherein the leadframe is made from a material on a basis of copper (Cu), wherein the leadframe comprises a first lead with a first contact surface and a second lead with a second contact surface; a bond wire made of a material on a basis of Cu bonded to the first terminal contact surface and the first contact surface; and a clip made of a material on a basis of Cu soldered to the second terminal contact surface and the second contact surface, wherein the first and second contact surfaces comprise the same material. | ||
| 地址 | Neubiberg DE | ||