| 发明名称 | Curable compositions | ||
| 摘要 | Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable composition are described herein. | ||
| 申请公布号 | US9120926(B2) | 申请公布日期 | 2015.09.01 |
| 申请号 | US201214356806 | 申请日期 | 2012.11.09 |
| 申请人 | Dow Global Technologies LLC | 发明人 | Karunakaran Radhakrishnan;Verghese Nikhil E. |
| 分类号 | C08L63/00;C08L71/02;C08L53/00 | 主分类号 | C08L63/00 |
| 代理机构 | Brooks, Cameron & Huebsch, PLLC | 代理人 | Brooks, Cameron & Huebsch, PLLC |
| 主权项 | 1. A curable composition comprising: an epoxy resin; a curing agent; and a block copolymer having a thermoset-philic block and a thermoset-phobic block, wherein the block copolymer is from 60 weight percent to 80 weight percent of the curable composition, the thermoset-philic block includes constitutional units that are derived from an alkylene oxide monomer, and the thermoset-phobic block includes constitutional units that are derived from an alkylene oxide monomer. | ||
| 地址 | Midland MI US | ||