Chip package structure and manufacturing method thereof

摘要

A chip package structure including a leadframe, a chip, at least one heat dissipation pillar, and a molding compound is provided. The leadframe includes a die pad and a plurality of leads. The die pad has at least one through hole. The leads surround the die pad. The chip is located on the die pad and electronically connected to the leads. The chip includes an active surface and a back surface opposite to the active surface. The back surface of the chip is adhered to the die pad. The heat dissipation pillar is located on the back surface and passes through the through hole. The molding compound encapsulates the chip, at least parts of the leads, and the die pad. The molding compound includes at least one opening to expose the heat dissipation pillar. A manufacturing method of the chip package structure is also provided.

主权项

1. A chip package structure comprising:
a leadframe comprising a die pad and a plurality of leads, the die pad having at least one through hole, the leads surrounding the die pad; a chip located on the die pad and electronically connected to the leads, the chip comprising an active surface and a back surface opposite to the active surface, the back surface of the chip being adhered to the die pad; at least one heat dissipation pillar formed by plating process and directly located on the back surface, the at least one heat dissipation pillar passing through the at least one through hole; and a molding compound encapsulating the chip, at least parts of the leads, and the die pad, the molding compound comprising at least one opening to expose the at least one heat dissipation pillar.