发明名称 |
Overlay abnormality gating by Z data |
摘要 |
The present disclosure relates to a method of monitoring wafer topography. A position and orientation of a plurality first alignment shapes disposed on a surface of a wafer are measured. Wafer topography as a function of wafer position is modeled by subjecting the wafer to an alignment which simultaneously minimizes misalignment between the wafer and a patterning apparatus and maximizes a focus of radiation on the surface. A non-correctable error is determined as a difference between the modeled wafer topography and a measured wafer topography. A maximum non-correctable error per field is determined for a wafer, and a mean variation in the maximum non-correctable error across each field within each wafer of a lot is determined, both within a layer and across layers. These values are then verified against a set of statistical process control rules to determine if they are within a specification limit of the manufacturing process. |
申请公布号 |
US9123583(B2) |
申请公布日期 |
2015.09.01 |
申请号 |
US201313940335 |
申请日期 |
2013.07.12 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Lin Chun-Hsien;Chao Kuo-Hung;Hsieh Yi-Ping;Tsen Yen-Di;Peng Jui-Chun;Liu Heng-Hsin;Mou Jong-I |
分类号 |
G01N21/00;H01L21/66;G01N21/95;G03F7/00;G01B13/06;G01B11/24 |
主分类号 |
G01N21/00 |
代理机构 |
Eschweiler & Associates, LLC |
代理人 |
Eschweiler & Associates, LLC |
主权项 |
1. A method of screening a wafer with a plurality of reticle fields, the method comprising:
modeling a topography over a surface of the wafer based on a plurality of first alignment shapes in a first layer overlying the surface to generate a modeled topography for the first layer, wherein the plurality of first alignment shapes is spaced over the surface with a first resolution; measuring the topography with a second resolution greater than the first resolution to generate a measured topography for the first layer; determining a plurality of first non-correctable errors for the first layer as a difference between the modeled topography and the measured topography, wherein the plurality of first non-correctable error are determined at a plurality of locations across the surface of the wafer; determining a maximum first non-correctable error from the plurality of first non-correctable errors for each reticle field of the plurality of reticle fields; and discarding the wafer or re-disposing the first layer if the maximum first non-correctable error within one or more reticle fields is above a first threshold. |
地址 |
Hsin-Chu TW |