发明名称 |
Motherboard |
摘要 |
A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover. |
申请公布号 |
US9125324(B2) |
申请公布日期 |
2015.09.01 |
申请号 |
US201213434879 |
申请日期 |
2012.03.30 |
申请人 |
ASUSTeK COMPUTER INC. |
发明人 |
Yen Heng-Yu;Huang Pai-Ching |
分类号 |
H05K7/20;H01L23/24;H01L23/427;G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
Jianq Chyun IP Office |
代理人 |
Jianq Chyun IP Office |
主权项 |
1. A motherboard, comprising:
a circuit board; a plurality of electronic components disposed at the circuit board; a metal cover covering the circuit board; a fastener fixing the metal cover to the circuit board, wherein the fastener is fastened to a device casing to make the metal cover connected to the device casing for grounding; and a flexible heat-conducting component disposed between the circuit board and the metal cover and contacting the electronic components and the metal cover, wherein the flexible heat-conducting component includes a flexible bag and a heat conducting material placed in the flexible bag, the flexible bag comprises vertical walls extending from a bottom of the flexible bag to a top of the flexible bag, and the flexible bag is divided into multiple accommodating spaces by the vertical walls, the heat conducting material is placed in the accommodating spaces. |
地址 |
Taipei TW |