发明名称 Motherboard
摘要 A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
申请公布号 US9125324(B2) 申请公布日期 2015.09.01
申请号 US201213434879 申请日期 2012.03.30
申请人 ASUSTeK COMPUTER INC. 发明人 Yen Heng-Yu;Huang Pai-Ching
分类号 H05K7/20;H01L23/24;H01L23/427;G06F1/20 主分类号 H05K7/20
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A motherboard, comprising: a circuit board; a plurality of electronic components disposed at the circuit board; a metal cover covering the circuit board; a fastener fixing the metal cover to the circuit board, wherein the fastener is fastened to a device casing to make the metal cover connected to the device casing for grounding; and a flexible heat-conducting component disposed between the circuit board and the metal cover and contacting the electronic components and the metal cover, wherein the flexible heat-conducting component includes a flexible bag and a heat conducting material placed in the flexible bag, the flexible bag comprises vertical walls extending from a bottom of the flexible bag to a top of the flexible bag, and the flexible bag is divided into multiple accommodating spaces by the vertical walls, the heat conducting material is placed in the accommodating spaces.
地址 Taipei TW