发明名称 |
Methods and applications of non-planar imaging arrays |
摘要 |
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface. |
申请公布号 |
US9123614(B2) |
申请公布日期 |
2015.09.01 |
申请号 |
US201313747826 |
申请日期 |
2013.01.23 |
申请人 |
MC10, Inc. |
发明人 |
Graff Bassel de;Callsen Gilman;Arora William J.;Ghaffari Roozbeh |
分类号 |
H01L21/00;H01L27/146;A61B1/04;A61B5/01;A61B5/145 |
主分类号 |
H01L21/00 |
代理机构 |
Nixon Peabody LLP |
代理人 |
Nixon Peabody LLP |
主权项 |
1. An imaging array, comprising:
a plurality of semiconductor imaging elements; at least one stretchable interconnect, the at least one stretchable interconnect coupling at least one semiconductor imaging element of the plurality of semiconductor imaging elements to another semiconductor imaging element; and at least one micro-lens disposed over at least a portion of at least one semiconductor imaging element of the plurality of semiconductor imaging elements. |
地址 |
Lexington MA US |