半导体装置的制造方法、半导体装置以及打线装置;METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPARATUS AND WIRE BONDING APPARATUS

摘要

本发明简便且有效率地将线尾的长度调整为一定。本发明的半导体装置的制造方法是具有将第1接合点与第2接合点连接的线弧的半导体装置的制造方法，且包括：将金属线42抽出且使接合工具40上升并自第2接合点向第1接合点侧的方向移动，在自接合工具40的前端延伸出的金属线42中的第2接合点附近，形成弯曲的被切断部92；使接合工具40下降，使接合工具40的前端压抵于金属线且使接合工具40移动至金属线的被切断部92；使接合工具40朝第2接合点向铅垂方向下降而加压，以使金属线的被切断部92变薄；将金属线42抽出且使接合工具40上升；使接合工具40沿远离第1接合点及第2接合点的方向且为将第1接合点与第2接合点连结的金属线方向移动，将金属线在被切断部92切断，以在接合工具40的前端形成线尾43。; descending the bonding tool 40 for the front end thereof to press against the wire and to move the bonding tool 40 to the cut off region 92 of the wire; descending the bonding tool 40 in a vertical direction toward the second bonding point for pressing to thin the cut off region 92 of the wire; pulling out the wire 42 and ascending the bonding tool 40; moving the bonding tool 40 along a direction away from the first bonding point and the second bonding point, and toward a direction of the wire for connecting the first bonding point and the second bonding point to cut off the wire in the cut off region 92 to form the wire tail 43 in the front end of the bonding tool 40.