可挑拣高长宽比晶粒之晶粒挑拣装置及方法;METHOD AND APPARATUS FOR PICKING AND PLACING CHIP DIES WITH HIGH ASPECT RATIO

摘要

一种可挑拣高长宽比晶粒之挑拣晶粒方法，用来将复数个晶粒由一晶片承载盘挑拣并放置到一晶圆框上，包含有移动一挑拣臂，使该挑拣臂上两真空晶粒吸取头之一中心点与该晶片承载盘之一第一定位点重叠对齐，并计算一第一座标值；移动该挑拣臂，使该挑拣臂上两真空晶粒吸取头之该中心点与该晶片承载盘之一第二定位点重叠对齐，并计算一旋转角度；以及根据该座标值、该旋转角度、该晶片承载盘之尺寸及该复数个晶粒之排列位置或间距，将该挑拣臂上两真空晶粒吸取头移动至一晶粒上，以吸取该晶粒。; moving the picking arm such that the center point of the two vacuum chucks on the picking arm is aligned with a second anchor point on the chip try and calculating an angle of rotation; and moving the two vacuum chucks on the picking arm onto a chip die and picking the chip die according to the x and y coordinates, the angle of rotation, dimension of the chip tray, and positions or spacing between each of the plurality of chip dies.