Active matrix substrate

摘要

An active matrix substrate includes a substrate and an insulating unit arranged on the substrate. The substrate includes a display region and a periphery circuit region beside the display region. The periphery circuit region has at least a chip connecting unit. Each chip connecting unit includes a number of connecting elements. Each of the connecting elements includes a conducting pad and a wire electrically connected to the conducting pad. The conducting pads of the connecting elements are arranged in at least two rows. The insulating unit has a number of contact holes corresponding to the conducting pads so that each of the conducting pads is entirely exposed by the corresponding contact hole. The active matrix substrate is applied to a display device to increase reliability of the display device and improve the quality of the display device.

主权项

1. An active matrix substrate comprising:
a substrate comprising a display region and a peripheral circuit region beside the display region, the peripheral circuit region comprising at least one chip connecting unit, each chip connecting unit comprising a plurality of connecting elements, each connecting element comprising a conducting pad and a wire electrically connected to the conducting pad, and the conducting pads of the same chip connecting unit being arranged in at least two parallel rows wherein the conducting pads are used to bear an external IC chip; and an insulating unit arranged on the substrate, the insulating unit defining a plurality of contact holes corresponding to the respective conducting pads, and each of the contact holes being configured for entirely exposing the corresponding conducting pad wherein a first contact hole and a second contact hole are arranged adjacently in a first row separated by a portion of said insulating unit and are connected to a third contact hole located between said first contact hole and said second contact hole in a second row; wherein an interval is formed between each two neighboring conducting pads in the same row, each conducting pad arranged in a first row is aligned to face the corresponding interval of the conducting pads arranged in a second row, and parts of the wires connected to the conducting pads arranged in the first row pass through the corresponding intervals of the conducting pads arranged in the second row with each wire located in the corresponding interval between the conducting pads arranged in the second row is covered by the insulating unit, wherein a first conducting layer, an insulating layer, a second conducting layer, a protecting layer and a resin layer are formed in sequence on the substrate, the second conducting layer comprises the chip connecting unit, the insulating unit comprises the insulating layer, the protecting layer and the resin layer, each of the protecting layer and the resin layer defines a plurality of openings corresponding to the conducting pads respectively, and the contact holes of the insulating unit are comprised of the openings.