Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips

摘要

A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.

主权项

1. A method for producing a plurality of semiconductor chips, the method comprising:
providing a composite substrate, the composite substrate having a carrier and a utility layer that is attached to the carrier by means of a dielectric bonding layer, the composite substrate being provided for epitaxial deposition of semiconductor layers, wherein the composite substrate contains a radiation conversion material; depositing semiconductor layer sequence on the composite substrate, the semiconductor layer sequence having an active region configured to generate radiation; reducing a thickness of the carrier after depositing the semiconductor layer sequence and adjusting the color locus of the radiation emitted by the semiconductor chips by electrically contacting the semiconductor chips during at least part of the reducing the thickness; and singulating the composite substrate with the semiconductor layer sequence into a plurality of semiconductor chips.