发明名称 Server and heat dissipation system thereof
摘要 A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.
申请公布号 US9122463(B2) 申请公布日期 2015.09.01
申请号 US201314044880 申请日期 2013.10.03
申请人 Inventec (Pudong) Technology Corporation;INVENTEC CORPORATION 发明人 Lai Ling-Jun
分类号 G06F1/20;H05K5/00;H05K7/20 主分类号 G06F1/20
代理机构 CKC & Partners Co., Ltd. 代理人 CKC & Partners Co., Ltd.
主权项 1. A server comprising: a chassis; a plurality of processing units disposed inside the chassis in an array manner, each of the processing units comprising: a mother board;an electric heat source disposed on the mother board;a heat dissipation fin set attached to the electric heat source; anda stopping air bag having an air inlet opening and being located at a space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag; and an airflow generating device disposed inside the chassis for heat dissipation of the processing units, and when the airflow generating device is operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow generated by the airflow generating device from flowing through the space.
地址 Shanghai CN