发明名称 Composite carrier frame for plastic injection molding
摘要 Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.
申请公布号 US9120257(B2) 申请公布日期 2015.09.01
申请号 US201313740089 申请日期 2013.01.11
申请人 Apple Inc. 发明人 Nathanson Scott M.
分类号 B29C45/14;G06F1/16;B29L31/34 主分类号 B29C45/14
代理机构 Downey Brand LLP 代理人 Downey Brand LLP
主权项 1. A method for forming a composite carrier frame assembly used in an injection molding process, the injection molding process utilizing an injection molding machine with a mold, the method comprising: forming a set of inserts, the set of inserts including a peripheral mount coupled to inserts arranged at fixed positions with respect to each other, each of the inserts including an anchor portion and an exterior portion; forming a carrier frame that includes openings and feed holes, the openings configured to accommodate the mold and the feed holes arranged in rows proximate to edges of the carrier frame, the feed holes configured to engage with an advancing device that advances the carrier frame with respect to the mold; and coupling the set of inserts to the carrier frame such that the peripheral mount surrounds one of the openings and each of the inserts is within the one of the openings, wherein the anchor portion of each of the inserts is arranged to be inside of the mold and the exterior portion of each of the inserts is arranged to be outside of the mold during the injection molding process.
地址 Cupertino CA US