半导体晶粒的拾取装置以及拾取方法;PICK UP DEVICE AND PICK UP METHOD OF SEMICONDUCTOR DIE

摘要

本发明的半导体晶粒的拾取装置具备：载台20，包含吸附切割片12的吸附面22；抽吸开口40，设置于载台20的吸附面22；盖23，沿着吸附面22滑动而开闭抽吸开口40；及开口压力切换机构80，将抽吸开口40的压力在接近于真空的第一压力P1与接近于大气压的第二压力P2之间切换；且于拾取半导体晶粒15时，每当将抽吸开口40的压力自第一压力P1切换为第二压力P2时，使盖23仅向打开方向滑动规定距离。藉此，抑制半导体晶粒产生损伤而有效果地拾取半导体晶粒。; a suction opening 40 disposed at the adsorption surface 22 of the stage 20; a cover 23 configured to slide along the adsorption surface 22 and open and close the suction opening 40; and an opening pressure switching mechanism 80 configured to switch between a first pressure P1having pressure near vauum and a second pressure P2having pressure near atmosphere. Moreover, while semiconductor dies 15 are picked up, the cover 23 slides only a predetermined distance toward an opening direction when the pressure of the suction opening 40 is switched from the first pressure P1to the second pressure P2. Thus, the semiconductor dies can be inhibited from damage and picked up efficiently.