| 摘要 |
<p>The present invention provides a polymerized film forming method capable of suppressing degradation in adhesion between a polymerized film and a target surface even when a polymerized film forming temperature is lowered. The polymerized film forming method uses first base gas containing acid anhydride and second base gas containing diamine to form the polymerized film on the target surface of a target body, and comprises: (1) a process (step 1) of supplying gas containing an adhesion catalyst which improves adhesion between the target surface and the polymerized film to the target surface to perform a surface treatment on the target surface; and (2) a process (step 2) of supplying the first base gas and the second base gas to the target surface on which the surface treatment has been performed to form the polymerized film. During the surface treatment in the process (1), at least one among the first base gas and the second base gas is supplied in addition to the gas containing the adhesion catalyst.</p> |
