<p>The present invention relates to a stack-type semiconductor package. More particularly, the present invention relates to a stack-type semiconductor package capable of preventing the warpage of a package on package which is separated by an interposer. That is, the present invention is to provide a stack-type semiconductor package which prevents a non-wet error due to the warpage by molding a separate resin layer for preventing warpage on the bottom side of the substrate of a lower semiconductor package and holding a substrate in a resin layer for preventing instant warpage generated in the substrate.</p>
