METHOD OF FABRICATING BUMP PAD STRUCTURES HAVING BUFFER PATTERNS

摘要

Described is a method of fabricating bump pad structures having buffer patterns. The method includes the steps of: forming an upper layer on a lower layer; forming a metal wiring in the upper layer; forming a passivation layer for exposing the center region of the metal wiring on the upper layer; directly forming a buffer pattern exposing the center region of the metal wiring on a part of the passivation layer and covering selectively and asymmetrically the peripheral region of the metal wiring; forming a wrapping pattern covering the buffer pattern on the passivation layer and exposing the center region of the metal wiring; and forming a pad pattern on the center region of the metal wiring.