发明名称 ADHESIVE COMPOSITION FOR PROTECTING CIRCUIT
摘要 The present invention relates to an adhesive composition for protecting a circuit and, more specifically to an adhesive composition for protecting a circuit with excellent flame retardancy, adhesive strength, thermal resistance, flowability, etc, which are the physical properties required for an adhesive composition for protecting a circuit. The adhesive composition for protecting a circuit comprises: a thermoplastic resin; a thermosetting resin; a compatibilized resin; a hardener; a hardening accelerator; a flame retardant; and inorganic particles.
申请公布号 KR20150098483(A) 申请公布日期 2015.08.28
申请号 KR20140019817 申请日期 2014.02.20
申请人 TORAY ADVANCED MATERIALS KOREA INC. 发明人 IM, MIN HO;SIM, CHANG HOON;KIM, SUNG JIN;JEON, HAE SANG
分类号 C09J109/02;C09J11/00;C09J163/00 主分类号 C09J109/02
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