发明名称 |
ADHESIVE COMPOSITION FOR PROTECTING CIRCUIT |
摘要 |
The present invention relates to an adhesive composition for protecting a circuit and, more specifically to an adhesive composition for protecting a circuit with excellent flame retardancy, adhesive strength, thermal resistance, flowability, etc, which are the physical properties required for an adhesive composition for protecting a circuit. The adhesive composition for protecting a circuit comprises: a thermoplastic resin; a thermosetting resin; a compatibilized resin; a hardener; a hardening accelerator; a flame retardant; and inorganic particles. |
申请公布号 |
KR20150098483(A) |
申请公布日期 |
2015.08.28 |
申请号 |
KR20140019817 |
申请日期 |
2014.02.20 |
申请人 |
TORAY ADVANCED MATERIALS KOREA INC. |
发明人 |
IM, MIN HO;SIM, CHANG HOON;KIM, SUNG JIN;JEON, HAE SANG |
分类号 |
C09J109/02;C09J11/00;C09J163/00 |
主分类号 |
C09J109/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|